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  • Welcome to the Journal of Electronic Packaging on-line,
    Covering: Papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronic, and photonic components, devices, and systems.

    Current Issue
    September 2006
    Current Issue
    September 2006
    All Issues
    March 2000 – Present
    All Issues
    March 2000 – Present


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    © American Society of Mechanical Engineers
    ISSN: 1528-9044 | CODEN: JEPAE4